LMZ31710 power module is an easy to use integrated power solution. It integrates a 10A DC/DC converter with power MOSFET, a shielded inductor and multiple passive devices in a flat QFN package. This overall power solution requires only three external components and eliminates the loop compensation and magnetic component selection process.
This device uses 10 × ten × 4.3 mm QFN package, which can be easily soldered to the printed circuit board, and can achieve a compact load point design. This device can achieve more than 95% efficiency and has excellent power dissipation capability with a thermal resistance of 13.3 ° C/W. LMZ31710 provides the flexibility and feature set of discrete load point design, which is very suitable for power supply of a wide range of integrated circuits (ICs) and systems. Advanced packaging technology can provide a robust, durable and reliable power supply solution compatible with standard QFN mounting and testing technology.
characteristic
Fully integrated power solutions
Small flat design
– Pin compatibility with LMZ31707 and LMZ31704
10mm × 10mm × 4.3 mm package
Up to 95% efficiency
Eco-Mode ™ And light load efficiency (LLE)
The wide output voltage regulation range is 0.6V to 5.5V, and the reference accuracy is 1%
Support parallel operation for higher current
The optional split power rail can realize the
input voltage
Adjustable switching frequency range (200kHz to 1.2MHz) synchronized with external clock
Provide 180 ° out of phase clock signal
Adjustable slow start
Output voltage sequencing and tracking
Normal power output
Programmable undervoltage lockout (UVLO)
Overcurrent and overheat protection
Pre offset output start
Operating temperature range: – 40 ° C to+85 ° C
Enhanced heat dissipation: 13.3 ° C/W
Conform to EN55022 Class B radiation emission standard
-Integrated shield inductor
Utilize LMZ31,710 and WEBENCH ® Power Designer Create Custom Design Scheme
application
Broadband and communication infrastructure
Automatic test and medical equipment
Compact PCI/PCI Fast Interface/PXI Fast Interface
DSP and FPGA load point application