Mt25qu256aba1ew9-0sit wdfn-8 MCU agent has the lowest spot price

describe

Mt25q is a high-performance multiple input / output serial flash memory device. It has high-speed SPI compatible bus interface, local execution (XIP) function, advanced write protection mechanism and extended address access. Innovative, high-performance, dual and Quad I / O commands double or quadruple the transmission bandwidth of read and program operations.

features

• SPI compatible serial bus interface

• single and dual transmission rates (STR / DTR)

• clock frequency

-The maximum frequency of all protocols in str is 166 MHz

– the maximum frequency of all protocols in DTR is 90 MHz

• dual / quad I / O commands for increased throughput up to 90 MB / S

• protocols supported in STR and DTR

– extended I / O protocol

– dual I / O protocol

– four way I / O protocol

• local execution (XIP)

• program / erase pending operation

• volatile and nonvolatile configuration settings

• software reset

• additional reset pin for selected part number

• 3-byte and 4-byte address mode – enable memory

More than 128MB of access

• dedicated 64 byte OTP area outside main memory

– readable and user lockable

– use the program OTP command for permanent locking

• erase function

– batch erase

– sector erasure 64KB unified granularity

– sub sector erasure 4KB, 32KB granularity

• security and write protection

– volatile and nonvolatile locking and software

Write protection per 64KB sector

– nonvolatile configuration

– password protection

– hardware write protection: nonvolatile bits

(BP [3:0] and TB) define the size of the protected area

– program / erase protection during power up

– CRC detects unexpected changes in raw data

• electronic signature

– JEDEC standard 3-byte signature (ba19h)

– extended device ID: the other two bytes identify

Equipment factory options

• comply with jesd47h standard

– at least 100000 erase cycles per sector

– data retention period: 20 years (typical)

Option tag

• voltage

–1.7-2.0V U

• density

–256Mb 256

• equipment stacking

– monolithic a

• equipment generation B

• mold version a

• pin configuration

– reset and hold #8

• sector size

–64KB E

• packaging – JEDEC standard, ROHS standard

– 24 ball t-pbga 05 / 6mm x 8mm (5 PCs.)

5 (array)

twelve

– 24 ball t-pbga 05 / 6mm x 8mm (4 off)

6 (array)

fourteen

-Wafer level chip level package, 15 balls, 9 movable balls (xfwlbga 0.5p) 55

– 16 pin sop2300 mils (so16w, so16 wide, soic-16)

San Francisco

–W-PDFN-8 6mm x 5mm(MLP8 6mmx 5mm)

W7

– w-pdfn-8 8mm x 6mm (mlp8 8mm x 6mm)

W9

• standard security 0

• special options

– standard s

– car a

• operating temperature range

– from - 40 ° C to + 85 ° C

-Temperature from - 40 ° C to + 105 ° C
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