explain
Tmp103 is a digital output temperature sensor using 4-solder ball wafer level chip scale package (WCSP).
The resolution of tmp103 reading temperature can reach 1 ℃.
Tmp103 has a two-wire interface compatible with I2C and SMBus interfaces. In addition, the interface also supports multi device access (MDA) commands, allowing the master to communicate with multiple devices on the bus at the same time, so it is not necessary to send commands to each tmp103 on the bus.
Eight tmp103 can be connected in parallel and can be easily read by the host. Tmp103 is particularly ideal for space constrained, power sensitive applications with multiple temperature measurement areas that must be monitored.
The specified operating temperature range of tmp103 is - 40 ℃ to + 125 ℃.
characteristic
• multi device access (MDA):
– global read / write operations
• I2C ™/ SMBus ™ Compatible interface
• resolution: 8 bits
• accuracy: typical value is ± 1 ℃ (- 40 ℃ to + 100 ℃)
• low quiescent current:
– IQ in operation mode is 3 μ A (at 0.25hz frequency)
– IQ is 1 in shutdown mode μ A
• power range: 1.4V to 3.6V
• digital output
• packaging: 4-solder ball WCSP (wafer level chip scale packaging) (dsbga)
application
• mobile phones
• laptop
