Tms320f28335pgfa lqfp176 digital signal processor chip strong shipment
explain
C2000 ™ 32-bit microcontrollers are optimized for processing, sensing and driving to improve real-time control applications (e.g. industrial motor drivers, photovoltaic)
Closed loop performance in inverters and digital power supplies, electric vehicles and transportation, motor control, and induction and signal processing). The C2000 product line includes Delfino
™ ** Piccolo series and performance ™ Entry level performance series.
Tms320c2000 32-bit microcontroller is optimized in processing, sensing and driving, which can improve the closed-loop performance in real-time control applications.
C2000 ™ The microcontroller product line includes Delfino ™ ** Piccolo microcontroller family and performance ™ Entry level performance microcontroller family.
TMS320F28335、TMS320F28334、TMS320F28333、TMS320F28332、TMS320F28235、TMS320F28234
And tms320f28232 devices belong to TMS320C28X / Delfino DSC / MCU series devices, which are suitable for control applications with strict requirements
Highly integrated * * solution.
characteristic
• * * static CMOS technology
– up to 150MHz (6.67ns cycle time)
– 1.9v/1.8v core, 3.3V I / O design
• * * 32-bit CPU (TMS320C28X)
– IEEE 754 single precision floating point unit (FPU) (* * f2833x) – 16 × 16 and 32 × 32 MAC operation
– 16 × 16 dual mac
– Harvard bus architecture
– * * interrupt response and handling
– unified memory programming model
– code (using C / C + + and assembly language)
• 6-channel DMA controller (for ADC, McBSP
Epwm, xinf and saram)
• 16 bit or 32-bit external interface (xinf)
– address coverage * over 2m × sixteen
• on chip memory
– F28335、F28333、F28235：
256K × 16 flash memory, 34k × 16 SARAM
– F28334、F28234：
128K × 16 flash memory, 34k × 16 SARAM
– F28332、F28232：
64K × 16 flash memory, 26k × 16 SARAM
– 1K × 16 OTP ROM
• boot ROM (8K) × 16)
– with software startup mode (through SCI, SPI, can, I2C, McBSP, xinf and parallel I / O)
– standard math tables
• clock and system control
– on chip oscillator
– watchdog timer module
• the gpio0 to gpio63 pins can be connected to eight external terminals
One of the nuclear disruptions
• peripheral interrupt extension (PIE) block that supports all 58 peripheral interrupts • 128 bit security key / lock - protect flash / OTP / ram block - prevent firmware reverse engineering
• enhanced control peripherals
– output up to 18 PWM
– up to 6 hrpwm outputs with MEP resolution up to
150ps
– up to 6 event capture inputs
– up to 2 orthogonal encoder interfaces
– up to 8 32-bit timers
(6 for ECAP, 2 for eqep) – up to 9 16 bit timers
(6 for epwm and 3 for xintctr) • three 32-bit CPU timers
• serial port peripherals
– up to 2 can modules
– up to 3 SCI (UART) modules
– up to 2 McBSP modules (configurable as SPI)
– one SPI module
– 1 internal integrated circuit (I2C) bus
• 12 bit ADC, 16 channels
– 80ns conversion rate
– 2 × 8-channel input multiplexer
– two sample and hold
– single / synchronous conversion
– internal or external datum
• up to 88 individually programmable multiplexers with input filtering
Multiplex GPIO pin
• support JTAG boundary scan
– IEEE standard 1149.1-1990 standard test access ports and edges
Boundary scan architecture
• * * simulation characteristics
– analysis and breakpoint functions
– real time debugging with hardware
• development support includes
– ANSI C / C + + compiler / assembler / connector
– Code Composer Studio IDE
– DSP / BIOS and sys / BIOS
– digital motor control and digital power supply software library
• low power consumption mode to save energy consumption
– support idle, standby and shutdown modes
– disable separate peripheral clock
• byte order: small end byte order
• packaging options: – lead free, green packaging
– plastic ball grid array (BGA) with 176 solder balls (zjz)
– ™ 179 solder ball MICROSTAR BGA (zhh)
– 176 pin thin Quad flatpack (LQFP) (PGF)
– 176 pin heat dissipation enhanced thin Quad flatpack
(HLQFP) (PTP)
• temperature options:
– A: – 40 ° C to 85 ° C (PGF, zhh, zjz)
– s: – 40 ° C to 125 ° C (PTP, zjz)
– Q: – 40 ° C to 125 ° C (PTP, zjz) (AEC Q100 certified for automotive applications)
application
• * * driving assistance system (ADAS)
• building automation
• e-sales terminals
• electric vehicle / hybrid electric vehicle (EV / HEV) Powertrain
• factory automation
• grid infrastructure
• industrial transportation
• medical, health and fitness
• motor drive
• power transmission
• telecommunications infrastructure
• testing and measurement
C2000 ™ 32-bit microcontrollers are optimized for processing, sensing and driving to improve real-time control applications (e.g. industrial motor drivers, photovoltaic)
Closed loop performance in inverters and digital power supplies, electric vehicles and transportation, motor control, and induction and signal processing). The C2000 product line includes Delfino
™ ** Piccolo series and performance ™ Entry level performance series.
Tms320c2000 32-bit microcontroller is optimized in processing, sensing and driving, which can improve the closed-loop performance in real-time control applications.
C2000 ™ The microcontroller product line includes Delfino ™ ** Piccolo microcontroller family and performance ™ Entry level performance microcontroller family.
TMS320F28335、TMS320F28334、TMS320F28333、TMS320F28332、TMS320F28235、TMS320F28234
And tms320f28232 devices belong to TMS320C28X / Delfino DSC / MCU series devices, which are suitable for control applications with strict requirements
Highly integrated * * solution.
characteristic
• * * static CMOS technology
– up to 150MHz (6.67ns cycle time)
– 1.9v/1.8v core, 3.3V I / O design
• * * 32-bit CPU (TMS320C28X)
– IEEE 754 single precision floating point unit (FPU) (* * f2833x) – 16 × 16 and 32 × 32 MAC operation
– 16 × 16 dual mac
– Harvard bus architecture
– * * interrupt response and handling
– unified memory programming model
– code (using C / C + + and assembly language)
• 6-channel DMA controller (for ADC, McBSP
Epwm, xinf and saram)
• 16 bit or 32-bit external interface (xinf)
– address coverage * over 2m × sixteen
• on chip memory
– F28335、F28333、F28235：
256K × 16 flash memory, 34k × 16 SARAM
– F28334、F28234：
128K × 16 flash memory, 34k × 16 SARAM
– F28332、F28232：
64K × 16 flash memory, 26k × 16 SARAM
– 1K × 16 OTP ROM
• boot ROM (8K) × 16)
– with software startup mode (through SCI, SPI, can, I2C, McBSP, xinf and parallel I / O)
– standard math tables
• clock and system control
– on chip oscillator
– watchdog timer module
• the gpio0 to gpio63 pins can be connected to eight external terminals
One of the nuclear disruptions
• peripheral interrupt extension (PIE) block that supports all 58 peripheral interrupts • 128 bit security key / lock - protect flash / OTP / ram block - prevent firmware reverse engineering
• enhanced control peripherals
– output up to 18 PWM
– up to 6 hrpwm outputs with MEP resolution up to
150ps
– up to 6 event capture inputs
– up to 2 orthogonal encoder interfaces
– up to 8 32-bit timers
(6 for ECAP, 2 for eqep) – up to 9 16 bit timers
(6 for epwm and 3 for xintctr) • three 32-bit CPU timers
• serial port peripherals
– up to 2 can modules
– up to 3 SCI (UART) modules
– up to 2 McBSP modules (configurable as SPI)
– one SPI module
– 1 internal integrated circuit (I2C) bus
• 12 bit ADC, 16 channels
– 80ns conversion rate
– 2 × 8-channel input multiplexer
– two sample and hold
– single / synchronous conversion
– internal or external datum
• up to 88 individually programmable multiplexers with input filtering
Multiplex GPIO pin
• support JTAG boundary scan
– IEEE standard 1149.1-1990 standard test access ports and edges
Boundary scan architecture
• * * simulation characteristics
– analysis and breakpoint functions
– real time debugging with hardware
• development support includes
– ANSI C / C + + compiler / assembler / connector
– Code Composer Studio IDE
– DSP / BIOS and sys / BIOS
– digital motor control and digital power supply software library
• low power consumption mode to save energy consumption
– support idle, standby and shutdown modes
– disable separate peripheral clock
• byte order: small end byte order
• packaging options: – lead free, green packaging
– plastic ball grid array (BGA) with 176 solder balls (zjz)
– ™ 179 solder ball MICROSTAR BGA (zhh)
– 176 pin thin Quad flatpack (LQFP) (PGF)
– 176 pin heat dissipation enhanced thin Quad flatpack
(HLQFP) (PTP)
• temperature options:
– A: – 40 ° C to 85 ° C (PGF, zhh, zjz)
– s: – 40 ° C to 125 ° C (PTP, zjz)
– Q: – 40 ° C to 125 ° C (PTP, zjz) (AEC Q100 certified for automotive applications)
application
• * * driving assistance system (ADAS)
• building automation
• e-sales terminals
• electric vehicle / hybrid electric vehicle (EV / HEV) Powertrain
• factory automation
• grid infrastructure
• industrial transportation
• medical, health and fitness
• motor drive
• power transmission
• telecommunications infrastructure
• testing and measurement